- Form Factor Mezzanine
- Dimensions (mm) 88(W) | 60(D) | 14(H-TOP)
- Weight (g) 25
- Communication Interfaces up to 6x 10/100M copper/fibre optic ports
- FPGA Artix-7 family
Operating Temperature (Junction) -40 to +85ºC (TJ)
Recommended Use Case(s)HSR/PRP DAN, HSR/PRP Redbox, Ethernet Switch
SocTek Modules
SocTek Modules is SOC-E’s product line focused on providing specialized System-on-Modules (SoM) based on reconfigurable devices (FPGAs and SoPCs).
This product line is targeted for those who are interested in the core technologies provided by SOC-E, such as HSR/PRP redundancy for IEC61850, Time-Sensitive Networking, small form factor ethernet switches, etc… but do not have either the expertise, time or skills to perform a vertical integration of SocTek IP Core products.
When integrating our modules, it is either possible that SOC-E develops the firmware of the module (including the FPGA bitstream, OS in case of using a SoPC, etc…) or the end user with SOC-E support, thanks to our expertise and skills in FPGA designs.
SocTek Modules are also a great option for evaluating SocTek IP technology. Different evaluation kit-based platforms are available as a plug&play solutions, including the Multiport FMC board, which is a unique product in the world as no other offers that many ethernet interfaces in a single FMC form factor expansion card.
Key Features
- Optimized for SocTek IP Core Product Family
SocTek module products have been designed with the same applications in mind that make our IP technology appealing, such as ethernet networking or time synchronization. In this sense, our modules and boards are the perfect.
- Multiple Ethernet PHYs Available
In contrast with many other mezzanines & evaluation kits available in the market, SocTek modules populate ethernet PHYs to both PS (Processing System) and PL (Programmable Logic). This enables networking capabilities based on IP Core technology.
- Industrial Grade Components Only
Enables the use of SocTek modules not only for development and/or evaluation but also for direct integration into the end user platform/device.
- Extended Product Life Cycle
Thanks to the use of long-lasting components that allow using this SocTek module products in environments that require a life cycle of more than a decade.
- Fast Prototyping
Thanks to the availability of evaluation kits & example designs with SocTek IP Cores, allowing to shorten the development & prototyping window.
FPGA Modules Family
- Form Factor SO-DIMM-200
- Dimensions (mm) 67.6(W) | 55(D) | 5(H-TOP)
- Weight (g) 16
- Communication Interfaces up to 8x 10/100/1000M copper/fibre optic ports
- FPGA Artix-7 family
- Operating Temperature (Junction) -40 to +85ºC (TJ)
- Recommended Use Case(s) HSR/PRP DAN, HSR/PRP Redbox, Ethernet Switch
- Form Factor Mezzanine
- Dimensions (mm) 88(W) | 60(D) | 11(H-TOP)
- Weight (g) 30
Communication Interfaces up to 4x 10/100/1000M copper/fibre optic ports in PL, one (1x) 10/100/1000M copper/fibre port in PS (MIO)
- FPGA Zynq 7000 family
- Operating Temperature (Junction) -40 to +85ºC (TJ)
- Recommended Use Case(s) HSR/PRP DAN, HSR/PRP Redbox, Ethernet Switch, IEEE1588 (PTPv2)
- Form Factor Mezzanine
- Dimensions (mm) 88(W) | 66(D) | 16(H-TOP)
- Weight (g) 36
Communication Interfaces
up to 4x 10/100/1000M copper/fibre optic ports in PL
one (1x) 10/100/1000M copper/fibre port in PS (MIO)
- FPGA Zynq UltraScale+ family
- Operating Temperature (Junction) -40 to +85ºC (TJ)
- Recommended Use Case(s) HSR/PRP DAN, HSR/PRP Redbox, Ethernet Switch, IEEE1588 (PTPv2), TSN EndPoint/Switch
Form Factor FMC expansion card
Dimensions (mm)262(W) | 203(D) | 41(H-TOP)
Weight (g) 500
Communication Interfaces up to 18x 10/100/1000M over RJ45, 8x CAN-FD over DB9 conn., 8x LIN over DB9 conn
FPGA Not included
Operating Temperature (Junction) -40 to +85ºC (TJ)
Recommended Use Case(s) Development/testing platform for ethernet, CAN-FD and LIN based communications