CDIIF and Electronica China – Hongke presents SoC-e TSN solutions

In the last month, the Chengdu International Industry Fair (CDIIF) and the Electronica China fair were hold in China. These events took place in trade fairs hall in Chengdu and Shanghay respectively.

As one of the largest and most influential industry fairs worldwide, Chengdu International Industry Fair (CDIIF) chooses Chengdu – the important manufacturing base and strategic region of China, is created to serve the needs of China’s industry upgrading and transformation. CDIIF is dedicated to display the future look of the industry, put focus on China intelligent manufacturing. The product categories include: process automation, machine vision, industrial robots, new generation of information and digital factory solution, metal working and laser equipment, industrial components and new material etc. CDIIF is going to be the interpretation of how innovative technologies helping the development of industrial products and value chain.

When it comes to Electronica China, it is the only event of its kind to showcase the entire range of electronic components—from technologies and components to specific application fields. The product categories in this fair include: displays, micro and nanosystems/sensors, automotive technology, test and measurement, switch and interconnection technology, power supplies and PCBs, other circuit carriers/EMS.

Hongke highlighted the standard’s technological aspects as well as Application-specific topics relevant in the various markets/industries in which our TSN solutions could fit. With Time Sensitive Networking – TSN – standard Ethernet is extended to deliver great time synchronization and worst-case latency for applications that require robust, deterministic connectivity. TSN has broad impact especially in application areas like Industrial, Automotive and Aerospace.

Different customer use-cases with SoCe‘s TSN solutions were shown!


In the last picture can be apprecitated two of our solutions regarding TSN technology: MTSN Kit and Reyum’s TSN-BRIDGE.


MTSN Switch IP core is a flexible HDL code ready to generate TSN end-point or bridge implementations. It can be implemented optimally depending on the application. It can be configured to generate from a simple 2-ports TSN adaptor to a complex multiport switch. The designer can select, among other parameters, the number of ports and memory distribution for the switch implemented in the FPGA section.

The specific TSN protocols supported by current version of SoCe MTSN Switch IP are summarized at MTSN Switch IP Web site.

In order to test our MTSN IP Core, we had developed two kits that will be presented in the following section.

SoC-e MTSN Kits

MTSN Kit: This kit has been designed not only to test the MTSN Switch IP, but to support an advanced hands-on TSN as well. It is composed by two boards ready to run a TSN Network setup. This Kit mainly includes:

    • 2x SMARTmpsoc boards pre-loaded with TSN Evaluation Design.
    • 1x SMARTzynq board pre-loaded with Traffic Generator tool.

12x Port MTSN Kit: The Kit includes a reference design and software that allows evaluating SoCe TSN technology and develop custom TSN implementations by the user. This Kit mainly includes:

    • 2x SoC-e 100M/1GbE Multiport FMC boards.
    • 2x ZCU102 boards pre-loaded with 12+1 Port TSN Evaluation Design.
    • 1x Traffic Generator board.

In the next picture can be seen the demo included in the MTSN Kit which is divided into several tests in order to analyze the effects of enabling and disabling TSN features (synchronization, shapers, etc.). The parameters of the switch for each configuration are visible and editable through a regular Web Browser.


System-on-Chip engineering S.L. (SoCe) is a worldwide leading supplier of time-aware Ethernet networking solutions. SoC-e is pioneer in developing a portfolio of IP cores and rugged platforms that implement these technologies for critical systems.

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