SoC-e returns with TSN to Embedded World

Onces more, SoC-e will attend to Embedded World Exhibition&Conference , where exhibitors from around the world will share their latest innovations, developments and solutions for Internet-of-Things, hardware, software or system-on-chip design.

This year we will be there with two partners:

• On the one hand Hema Electronic, with a demo of #TSN on Ethernet. It is the ideal foundation for IT and OT convergence and for a common, flexible and scalable infrastructure for all data transfers. You can find it at booth hema 2-444.
• And on the other hand Minerva Systems, with a demo about #TSN on autonomous driving car following a predefined trajectory. You can find this one in Hall 3A, booth 333.

If you want to have the opportunity to connect with a large number of experts and qualified suppliers from all over the world, you can not miss this appointment. You will have access to specialized forums, expert panels, the electronic displays Conference, or embedded world Conference where experts meet at eye-level to jointly develop ideas and concepts for the future.

Come and see us!

David Modroño, SoC-e’s Business Manager, will be there to answer any question about the latest updates to SoC-e IP Cores and Modules.
You can get in touch with him by email info@soc-e.com

Meet us at the Embedded World Exhibition&Conference 2023 Nuremberg, March 14-16!